Items where Author is "Piaw, T. K. "

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Debnath , Sujan and Piaw, T. K. and Woldemichael, Dereje Engida (2013) Thermo-Mechanical Stress Analysis in Electronic Packaging with Continuous and Partial Bond Layer. [Citation Index Journal] (In Press)

This list was generated on Fri Nov 22 12:42:50 2024 +08.