Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding

Wire bonding is a process that is used to form solid-state bonds to interconnect metals such as gold wires to metalized pads
deposited on silicon integrated circuits. Typically, there are 3 main wire bonding techniques; Thermo-compression, Ultrasonic and
Thermosonic. This experiment utilizes thermosonic bonding which applies heat, ultrasonic energy and force on an Au-Al system. Sixteen
groups of bonding conditions at various temperature settings were compared to establish the relationship between ball deformation and
temperature. The results of this study will clearly indicate the effects of applied bonding temperature towards bond strength and deformation
characteristics of gold ball bonding