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Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding

Singh, Gurbinder and Mamat, Othman (2011) Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding. [Citation Index Journal]

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Official URL: http://dx.doi.org/10.4236/jsemat.2011.13018

Abstract

Wire bonding is a process that is used to form solid-state bonds to interconnect metals such as gold wires to metalized pads deposited on silicon integrated circuits. Typically, there are 3 main wire bonding techniques; Thermo-compression, Ultrasonic and Thermosonic. This experiment utilizes thermosonic bonding which applies heat, ultrasonic energy and force on an Au-Al system. Sixteen groups of bonding conditions at various temperature settings were compared to establish the relationship between ball deformation and temperature. The results of this study will clearly indicate the effects of applied bonding temperature towards bond strength and deformation characteristics of gold ball bonding

Item Type:Citation Index Journal
Subjects:Q Science > Q Science (General)
T Technology > TJ Mechanical engineering and machinery
Departments / MOR / COE:Research Institutes > Institute for Autonomous Systems
ID Code:7503
Deposited By: Assoc. Prof. Dr. Othman Mamat
Deposited On:12 Mar 2012 00:14
Last Modified:19 Jan 2017 08:23

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