Effect Of Particle Dispersion On Thermal Conductivity Of Copper Powder Filled Epoxy Composites

Megat-Yusoff, Puteri Sri Melor and Ahmad, Faiz and Amir, Norlaili and Leong, Siew Yoong (2010) Effect Of Particle Dispersion On Thermal Conductivity Of Copper Powder Filled Epoxy Composites. AIP Conference Proceedings, 1217 (1). pp. 363-369. ISSN 0094243X

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The thermal conductivity of the epoxy can be enhanced by incorporating conductive particles. These materials have the potential to be used as heat sink in electronic devices. This paper presents the results of developing copper powder reinforced epoxy composite and measurements of their thermal conductivity. Epoxy composites containing 5, 10 and 15 wt% copper particles were developed and the thermal conductivities were measured using the guarded comparative longitudinal heat flow technique. The thermal conductivity of 100% epoxy was found to be 0.204±0.018 W/m-K and this value was 10% less compared to that of the theoretical value. The thermal conductivity measured for the epoxy composites containing 5wt%, 10wt% and 15wt% copper powder were 0.512±0.115, 2.094±0.080 and 2.432±0.210 W/m-K, respectively. Scanning Electron Microscope (SEM) was used to examine the dispersion of copper particles in the epoxy. Poor dispersion of the conductive filler in the epoxy led to the formation of agglomerates resulting in reduced thermal conductivity of the epoxy composites.

Item Type:Article
Uncontrolled Keywords:polymers, heat sinks, fibre reinforced composites, scanning electron microscopy
Subjects:Q Science > QD Chemistry
Departments / MOR / COE:Departments > Mechanical Engineering
ID Code:5899
Deposited By: Dr Norlaili Amir
Deposited On:02 Aug 2011 04:04
Last Modified:01 Apr 2014 03:00

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