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Signal Integrity Analysis for High Speed Digital Circuit

Ting, Mei Shang and Lee, Sheng Chyan and Sebastian , Patrick (2010) Signal Integrity Analysis for High Speed Digital Circuit. In: 2010 International Conference on Intelligent and Advanced Systems, 15-17 June 2010, Kuala Lumpur.

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Abstract

This paper presents a study on various signal integrity (SI) issues that could affect signals on Printed Circuit Boards (PCBs). This paper is aimed to analyze and have a better understanding on the nature of signal integrity, how the problem is manifested in PCB designs and what design solutions can be employed to minimize its effects. The PCB designs are modelled using the Advanced Design System (ADS). PCB fabrication and testing on the Digital Communication Analyzer (DCA) follows up and the results obtained coincide with theoretical claims obtained at the initial stage of this paper.

Item Type:Conference or Workshop Item (Paper)
Subjects:T Technology > TK Electrical engineering. Electronics Nuclear engineering
Departments / MOR / COE:Departments > Electrical & Electronic Engineering
ID Code:3389
Deposited By: Patrick Sebastian
Deposited On:20 Dec 2010 06:46
Last Modified:19 Jan 2017 08:23

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