A review of graphene reinforced Cu matrix composites for thermal management of smart electronics

Ali, S. and Ahmad, F. and Yusoff, P.S.M.M. and Muhamad, N. and Oñate, E. and Raza, M.R. and Malik, K. (2021) A review of graphene reinforced Cu matrix composites for thermal management of smart electronics. Composites Part A: Applied Science and Manufacturing, 144 .

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Heat dissipation remains a key challenge to be addressed, determining the performance and durability of smart electronic devices. Graphene reinforced metal matrix composites have been extensively studied as a thermal management material due to their high thermal conductivity and low coefficient of thermal expansion. The emphasis of this review is pivoted on the thermal conductivity enhancement of graphene reinforced Cu matrix composites developed in the recent literature. An overview of factors affecting thermal conductivity of composite namely defect processing route, density, graphene derivative, lateral size, concentration, alignment, graphene/matrix interfacial bonding and graphene modification are discussed. An extensive weightage is given to the processing route as it is the most influential factor in determining the enhancement efficiency. Furthermore, graphene based functional products such as heat spreader and heat sink developed for heat dissipation of electronic devices are also reviewed. Finally, the development and outlook for graphene based Cu composites are presented. © 2021 Elsevier Ltd

Item Type:Article
Impact Factor:cited By 0
Uncontrolled Keywords:Bonding; Copper; Electronic equipment; Metallic matrix composites; Reinforcement; Temperature control; Thermal conductivity; Thermal expansion; Thermoelectric equipment, Cu matrix composites; Enhancement efficiency; High thermal conductivity; Influential factors; Low coefficient of thermal expansions; Reinforced metal matrix composites; Thermal conductivity enhancement; Thermal management material, Graphene
ID Code:23878
Deposited By: Ms Sharifah Fahimah Saiyed Yeop
Deposited On:19 Aug 2021 13:25
Last Modified:19 Aug 2021 13:25

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